Work Packages for a Cleaner, Smarter Semiconductor Future
Work Package 1
Management, Specifications, and Methods
Lead Partner: CEA-Leti
France
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Ensure the effective coordination of the project, define specifications, and implement unified methodologies across all technical and reporting tasks.
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T1.1 Technical, administration and financial co-ordination
T1.2 Definition of general specifications and technical recommendations
T1.3 Environmental impact assessment
Work Package 2
Process, Monitoring & Sensing Hardware and Solution
Lead Partner: CSEM
Switzerland
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Develop next-gen sensing and monitoring systems for semiconductor manufacturing to reduce reliance on harmful substances and improve efficiency.
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T2.1 Process and metrology equipment, infrastructure adaptation and solutions development
T2.2 Gas environment monitoring and sensing hardware and solutions developments
T2.3 Aqueous environment monitoring and sensing hardware and solutions developments
Work Package 3
Environmentally Friendly Materials Alternatives
Lead Partner: IMEC
Belgium
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Design and evaluate alternatives to hazardous materials currently used in semiconductor processes.
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T3.1 PFAS alternative materials and process developments
T3.2 GHG and other hazardous materials alternatives and process development
T3.3 Alternative polymer materials development and integration
Work Package 4
Minimisation of Waste and Emissions
Lead Partner: Fraunhofer
Germany
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Implement strategies and technologies that significantly reduce chemical waste and emissions in semiconductor fabs.
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T4.1 Gas abatement in-lab and lab2fab qualifications
T4.2 Aqueous abatements and capture systems - in-lab and lab2fab qualifications
T4.3 Waste recycling & re-use solutions
Work Package 5
Materials Scarcity Impact Mitigation
Lead Partner: UNITOV
Italy
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Identify critical raw materials at risk and propose mitigation strategies through reuse, substitution, or circular economy solutions.
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T5.1 Novel solutions to prevent material scarcity impact
T5.2 Waste recycling & re-use of scarce materials solutions
Work Package 6
Regulations, Dissemination, Communication and Exploitation
Lead Partner: SEMI Europe
Germany
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Ensure regulatory alignment, effective communication, widespread dissemination, and long-term impact of project results.
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T6.1 Regulation Deployments
T6.2 Dissemination, communication and Exploitation
Contact us.
contactus@genesiseu.eu