Work Packages for a Cleaner, Smarter Semiconductor Future
Work Package 1
Management, Specifications, and Methods
Lead Partner: CEA-Leti
France
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Ensure the effective coordination of the project, define specifications, and implement unified methodologies across all technical and reporting tasks.
Work Package 2
Process, Monitoring & Sensing Hardware and Solution
Lead Partner: CSEM
Switzerland
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Develop next-gen sensing and monitoring systems for semiconductor manufacturing to reduce reliance on harmful substances and improve efficiency.
Work Package 3
Environmentally Friendly Materials Alternatives
Lead Partner: IMEC
Belgium
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Design and evaluate alternatives to hazardous materials currently used in semiconductor processes.
Work Package 4
Minimisation of Waste and Emissions
Lead Partner: Fraunhofer
Germany
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Implement strategies and technologies that significantly reduce chemical waste and emissions in semiconductor fabs.
Work Package 5
Materials Scarcity Impact Mitigation
Lead Partner: UNITOV
Italy
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Identify critical raw materials at risk and propose mitigation strategies through reuse, substitution, or circular economy solutions.
Work Package 6
Regulations, Dissemination, Communication and Exploitation
Lead Partner: SEMI Europe
Germany
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Ensure regulatory alignment, effective communication, widespread dissemination, and long-term impact of project results.
Contact us.
contactus@genesiseu.eu