Work Packages for a Cleaner, Smarter Semiconductor Future

Work Package 1

Management, Specifications, and Methods

Lead Partner: CEA-Leti

France

  • Ensure the effective coordination of the project, define specifications, and implement unified methodologies across all technical and reporting tasks.

    • T1.1 Technical, administration and financial co-ordination

    • T1.2 Definition of general specifications and technical recommendations

    • T1.3 Environmental impact assessment

Work Package 2

Process, Monitoring & Sensing Hardware and Solution

Lead Partner: CSEM

Switzerland

  • Develop next-gen sensing and monitoring systems for semiconductor manufacturing to reduce reliance on harmful substances and improve efficiency.

    • T2.1 Process and metrology equipment, infrastructure adaptation and solutions development

    • T2.2 Gas environment monitoring and sensing hardware and solutions developments

    • T2.3 Aqueous environment monitoring and sensing hardware and solutions developments

Work Package 3

Environmentally Friendly Materials Alternatives

Lead Partner: IMEC

Belgium

  • Design and evaluate alternatives to hazardous materials currently used in semiconductor processes.

    • T3.1 PFAS alternative materials and process developments

    • T3.2 GHG and other hazardous materials alternatives and process development

    • T3.3 Alternative polymer materials development and integration

Work Package 4

Minimisation of Waste and Emissions

Lead Partner: Fraunhofer

Germany

  • Implement strategies and technologies that significantly reduce chemical waste and emissions in semiconductor fabs.

    • T4.1 Gas abatement in-lab and lab2fab qualifications

    • T4.2 Aqueous abatements and capture systems - in-lab and lab2fab qualifications

    • T4.3 Waste recycling & re-use solutions

Work Package 5

Materials Scarcity Impact Mitigation

Lead Partner: UNITOV

Italy

  • Identify critical raw materials at risk and propose mitigation strategies through reuse, substitution, or circular economy solutions.

    • T5.1 Novel solutions to prevent material scarcity impact

    • T5.2 Waste recycling & re-use of scarce materials solutions

Work Package 6

Regulations, Dissemination, Communication and Exploitation

Lead Partner: SEMI Europe

Germany

  • Ensure regulatory alignment, effective communication, widespread dissemination, and long-term impact of project results.

    • T6.1 Regulation Deployments

    • T6.2 Dissemination, communication and Exploitation

Contact us.

contactus@genesiseu.eu